CAS No.: | 2809-21-4 |
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Formula: | C2h8o7p2 |
EINECS: | 220-552-8 |
Classification: | Organic Analytical Reagents |
Grade: | AR |
Specific Usage: | For Biological Purpose, For Tissue Medium Purpose, For Microbiological, For Microscopic Purpose, For Electron Microscopy, For Lens Blooming, Technical Grade, Pratical Use, Pro Analysis, Super Special Grade, For Synthesis, For Scintillation, For Electrophoresis Use, For Refractive Index |
Samples: |
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Product Name: 1-Hydroxyethylidene-1,1-diphosphonic acid HEDP
Synonym: 1-Hydroxyethylidene-1,1-diphosphonic acid HEDP
CAS No.:2809-21-4
Molecular Formula: C2H8O7P2
Molecular weight:206.03
Specifications:
appearance | White crystal |
Phosphoric acid( as PO43-)% | 0.12 |
Phosphorous acid(as PO33-) % | 0.33 |
Chloride (as Cl-) ppm | 45.91 |
PH(1%) | 1.65 |
Fe ion ppm | 4.73 |
Active content( as
HEDP.H2O)% |
99.31 |
Active content( as acid) % | 91.33 |
Packing: 25KG/bag
Application:
This product is the main material for cyanide free electroplating. The cyanide free copper plating solution is prepared, and the copper layer is directly plated on sodium iron with good adhesion. It is commonly used as scale and corrosion inhibitor in boiler water, circulating water and oilfield water injection treatment.
Hydroxyethylidene diphosphonic acid (HEDP) is a new ch lorine free electroplating complexing agent. It is used as the main agent for water quality stability in circulating cooling water system and plays the role of corrosion and scale inhibition.
It is a scale inhibitor and corrosion inhibitor for boilers and heat exchangers, a complexing agent for cyanide free electroplating, a chelating agent for soap, and a cleaning agent for metal and non-
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